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Wafer Pre Aligner - Back-side VAC Chucking
Product：Pre-Aligner Back-side VAC Chucking
Handling object：200mm-300mm wafer；SEMl/JElDA standard wafer.
Alignment time：3 seconds or less(when processing 300mm)
Alignment accuracy：XY=±0.1mm or less，T=±0.1 deg or less
Wafer off-center limit：±5mm or less(wafer offset from chuck center)
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Wafer Pre Aligner - Back-side VAC Chucking
Wafer pre aligner which is with back-side VAC Chucking, is for 200-300mm SEMl/JElDA standard wafer. In stock!
Data Sheet
Product | Pre-Aligner Back-side VAC Chucking |
Handling object | 200mm-300mm wafer SEMl/JElDA standard wafer. (Please inquire with regard tospecial wafer.) |
Alignment time | 3 seconds or less(when processing 300mm) |
Alignment accuracy | XY=±0.1mm or less T=±0.1 deg or less |
Wafer off-center limit | ±5mm or less(wafer offset from chuck center) |
Wafer holding method | Backside vacuum chuck |
Wafer hold check | Vacuum sensor with digital display |
Network Protocol | RS232C RS485(optional) Parallel trafic (optional) |
Power source | 24V DC±10%, 5A, 1-line |
Customization
TAZMO semiconductor wafer handling robots can be customized according to client’s configuration request. Please provide such information below when you send us inquires:
Elevator mechanism | Z:Yes |
N:None | |
Chuck material | P:PPS |
K:PEEK | |
Z:Custom | |
Work size | A:200-300mm |
B:100-200mm(3-inch option supported) | |
C:150-300mm(Compatible with 3 sizes) | |
Sensor type & chuck method | A:Analogue receptor(vacuum type) [Silicon wafer] |