Edge-hold Wafer Pre-aligner 300MM MAF-S
This 300mm mechanically clamping wafer aligner minimizes wafer particle contamination by avoiding contact with the backside of the wafer.
Data Sheet:
| Product | Pre-Aligner Edge hold |
| Model | MAF-S |
| Handling object | 300mm wafer (notch/flat)
SEMl/JElDA standard wafer. (Please inquire with regard tospecial wafer.) |
| Alignment time | 8.5 seconds or less (20 seconds or less when separate chucking required) |
| Alignment accuracy | T=±0.2deg |
| Wafer off-center limit | ±1mm or less(wafer offset from chuck center) |
| Wafer holding method | Wafer-edge partial gripping |
| Wafer hold check | Photomicro sensor |
| Network Protocol | RS232C |
| Power source | 24V DC±10%, 5A, 1-line |
Customizaation:
| Elevator mechanism | Z:Yes |
| N:None | |
| Chuck material | P:PPS |
| K:PEEK | |
| Z:Custom | |
| Work size | H:300mm |
| J: 200mm | |
| K:150mm | |
| Sensor type & chuck method | S:CCD receptor(grip type) [Glass and compound wafer] |
