Bernoulli Wafer Aligner For Thin Wafer Handling MAF-T Series
Data Sheet
| Product | Bernoulli Pre-Aligner For thin wafer handling needs |
| Model | MAF-T |
| Handling object | 100-150mm(thickness:50-800 um) wafer
150-200mm(thickness:50-800um)wafer 200-300mm(thickness:50-800um)wafer (Please inquire with regard to special wafer.) |
| Alignment time | 5.5 seconds or less(when not separate chucking) |
| Alignment accuracy | XY=±0.1mm
T=±0.1deg |
| Wafer off-center limit | ±5mm or less(wafer offset from chuck center) |
| Wafer holding method | Wafer backside minimum partial contact |
| Wafer hold check | Reflective red LED sensor |
| Network Protocol | RS232C |
| Power source | 24V DC±10%, 5A, 1-line |
Customization:
| Elevator mechanism | Z:Yes |
| N:None | |
| Chuck material | B:Fluorocarbon polymers |
| Work size | H:300mm |
| I:150~200mm | |
| L:100-150mm(3-inch option supported) | |
| Sensor type & chuck method | T:CCD receptor(Contact type Bernoulli) |
