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Wafer Handling Robot For PLP, Double Arm

  • Model No: PLP Double
    Motor type: servo motor
  • Robot arm type:Double arm 
  • Operating axis: R1/R2/T/Z
  • Operating environment: Atmospheric
  • suitable for Square substrate 300-650mmm

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Wafer Handling Robot For PLP, Double Arm

This wafer handling robot is double arm with servo motor, developed for PLP to hold square substrate of size 300-650mm.

Data Sheet

Model Series

PLP Series

Motor type

Servo motor

Robot arm type

Double arm

Target work/Handling object

Square substrate 300-650mmm

Operating axis

R1/R2/T/Z

Range of motion

RI-axis, R2-axis: Maximum arm reach 760mm(from swivel center)

T:±185deg

Z:500mm

S:880mm

Repeatability

R2,R2 ±0.1 mm

T: ±0.03 deg

Z: ±0.1 mm

S: ±0.25 mm

Wafer handling method

Vacuum chuck

Gripper

Recess(pocket)

Wafer hold check

Vacuum chuck: Vacuum sensor with digital display

Gripper:Photomicro sensor

Network protocol

RS232C ETHERNET

Utility Power/Power source

Single-phase or Three-phase AC200V~230V +10% 5A~30A

Customization

TAZMO semiconductor wafer handling robots can be customized according to client’s configuration request. Please provide such information below when you send us inquires:

TypeDescription
Arm typeT: Cylindrical Coordinate Standard Single
W: Cylindrical Coordinate Standard Double
R: Square Coordinate Standard Single
Elevator typeS: Standard
W: Telescopic 2-step Elevation
Hand typeN: None
H: Horizontal changer
T: Reverse
Arm1: 385mm(R·W)
2: 179mm(R·W)
4: 220mm(R·T)
6: 300mm(T)
8: 370mm
Elevator1: 500mm(S·W)
2: 700mm(W)
4: 300mm(S)
Slide rail0: None
1: 505mm
2: 1010mm
3: 1515mm
4: 2020mm
6: 600mm
8: 1800mm
9: 880mm
I: 2000mm
J: 2060mm
Work gripping method (hand 1)N: None
G: Gripper
V: Vacuum chuck
R: Recess (without seating sensor)
P: Recess (with seating sensor)
Work gripping method (hand 2)N: None
V: Vacuum chuck
G: Gripper
R: Recess (without seating sensor)
P: Recess (with seating sensor)
Mapping sensorT: Transparent type
N: None
R: Reflective type