Pre-Aligner – Xwetool https://www.xwetool.com Tue, 21 Oct 2025 06:40:32 +0000 en-US hourly 1 https://wordpress.org/?v=6.9 https://www.xwetool.com/wp-content/uploads/2024/10/cropped-site-identity-32x32.jpg Pre-Aligner – Xwetool https://www.xwetool.com 32 32 TAZMO Wafer Aligner 300MM For Compound and Glass Wafer MAF-V https://www.xwetool.com/product/wafer-aligner-300mm-maf-v/ Tue, 21 Oct 2025 06:38:42 +0000 https://www.xwetool.com/?post_type=product&p=3286 TAZMO Wafer Aligner 300MM For Compound and Glass Wafer

 

Data Sheet

Product Pre-Aligner Edge hold
Model MAF-V
Handling object 300mm SEMl standard wafer

(Please inguire with regard tospecial wafer)
Alignment time 10.5 seconds or less(21 seconds or less when separate chucking required)
Alignment accuracy T=±0.3deg
Wafer off-center limit ±1mm or less(wafer offset from chuck center)
Wafer holding method Drop-in + end fac econtact retention

(clamp wafer by stroke end)
Wafer hold check Limited reflective fiber sensor(2 locations)
Network Protocol RS232C
Power source 24V DC±10%, 5A, 1-line

Customization:

Elevator mechanism Z:Yes
N:None
Chuck material P:PPS
K:PEEK
Z:Custom
Work size H:300mm
J: 200mm
K:150mm
Sensor type & chuck method V:CCD receptor(Drop-in+end facecontact retention) [Glass and compound wafer]
]]> Bernoulli Wafer Aligner For Thin Wafer Handling MAF-T Series https://www.xwetool.com/product/bernoulli-wafer-aligner-maf-t/ Thu, 16 Oct 2025 07:14:49 +0000 https://www.xwetool.com/?post_type=product&p=3283 Bernoulli Wafer Aligner For Thin Wafer Handling MAF-T Series

 

Data Sheet

Product Bernoulli Pre-Aligner For thin wafer handling needs
Model MAF-T
Handling object 100-150mm(thickness:50-800 um) wafer

150-200mm(thickness:50-800um)wafer

200-300mm(thickness:50-800um)wafer

(Please inquire with regard to special wafer.)
Alignment time 5.5 seconds or less(when not separate chucking)
Alignment accuracy XY=±0.1mm

T=±0.1deg
Wafer off-center limit ±5mm or less(wafer offset from chuck center)
Wafer holding method Wafer backside minimum partial contact
Wafer hold check Reflective red LED sensor
Network Protocol RS232C
Power source 24V DC±10%, 5A, 1-line

Customization:

Elevator mechanism Z:Yes
N:None
Chuck material B:Fluorocarbon polymers
Work size H:300mm
I:150~200mm
L:100-150mm(3-inch option supported)
Sensor type & chuck method T:CCD receptor(Contact type Bernoulli)
]]> Wafer Pre-aligner 300MM Edge-hold MAF-S Series https://www.xwetool.com/product/wafer-pre-aligner-300mm-maf-s/ Tue, 14 Oct 2025 02:14:43 +0000 https://www.xwetool.com/?post_type=product&p=3279 Edge-hold Wafer Pre-aligner 300MM MAF-S

This 300mm mechanically clamping wafer aligner minimizes wafer particle contamination by avoiding contact with the backside of the wafer.

Data Sheet:

Product Pre-Aligner Edge hold
Model MAF-S
Handling object 300mm wafer (notch/flat)

SEMl/JElDA standard wafer.

(Please inquire with regard tospecial wafer.)
Alignment time 8.5 seconds or less (20 seconds or less when separate chucking required)
Alignment accuracy T=±0.2deg
Wafer off-center limit ±1mm or less(wafer offset from chuck center)
Wafer holding method Wafer-edge partial gripping
Wafer hold check Photomicro sensor
Network Protocol RS232C
Power source 24V DC±10%, 5A, 1-line

Customizaation:

Elevator mechanism Z:Yes
N:None
Chuck material P:PPS
K:PEEK
Z:Custom
Work size H:300mm
J: 200mm
K:150mm
Sensor type & chuck method S:CCD receptor(grip type) [Glass and compound wafer]

 

]]> Wafer Aligner MAF-H 200MM – Edge Hold https://www.xwetool.com/product/wafer-aligner-200mm-maf-h/ Mon, 16 Jun 2025 09:26:20 +0000 https://www.xwetool.com/?post_type=product&p=2501 Wafer Pre Aligner MAF-A – Back-side VAC Chucking https://www.xwetool.com/product/wafer-pre-aligner-maf-a/ Mon, 16 Jun 2025 09:26:18 +0000 https://www.xwetool.com/?post_type=product&p=2500 Wafer Pre-Aligner MAF-R – Edge Contact Free https://www.xwetool.com/product/pre-aligner-maf-r/ Mon, 16 Jun 2025 07:20:30 +0000 https://www.xwetool.com/?post_type=product&p=2475 Wafer Pre-Aligner MAF-R – Edge Contact Free

Product Pre-Aligner Back-side VAC Chucking MAF-R
Handling object 200mm-300mm

SEMI&JEIDA standard wafer

(Please inquire with regard tospecial wafers such as glass wafer.)
Alignment time 4.5 seconds or less(when processing 300mm)
Alignment accuracy XY=±0.1mm or less

T=±0.1deg or less
Wafer off-center limit ±5mm or less (wafer offset from chuck center)
Wafer holding method Backside vacuum chuck
Wafer hold check Vacuum sensor with digital display
Network Protocol RS232C

RS485(optional)

Parallel trafic (optional)
Power source 24V DC±10%, 5A, 1-line

Customization:

Elevator mechanism Z:Yes
N:none
Chuck material P:PPS
K:PEEK
Z:Custom
Work size A:200-300mm
B:100-200mm(3-inch option supported)
C:150-300mm(Compatible with 3 sizes)
Sensor type & chuck method R:CCD receptor(vacuum type) [Glass and compound wafer]
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