Wafer Robot&Aligner – Xwetool https://www.xwetool.com Thu, 23 Oct 2025 03:26:27 +0000 en-US hourly 1 https://wordpress.org/?v=6.9.1 https://www.xwetool.com/wp-content/uploads/2024/10/cropped-site-identity-32x32.jpg Wafer Robot&Aligner – Xwetool https://www.xwetool.com 32 32 TAZMO Wafer Aligner 300MM For Compound and Glass Wafer MAF-V https://www.xwetool.com/product/wafer-aligner-300mm-maf-v/ Tue, 21 Oct 2025 06:38:42 +0000 https://www.xwetool.com/?post_type=product&p=3286 TAZMO Wafer Aligner 300MM For Compound and Glass Wafer

 

Data Sheet

Product Pre-Aligner Edge hold
Model MAF-V
Handling object 300mm SEMl standard wafer

(Please inguire with regard tospecial wafer)
Alignment time 10.5 seconds or less(21 seconds or less when separate chucking required)
Alignment accuracy T=±0.3deg
Wafer off-center limit ±1mm or less(wafer offset from chuck center)
Wafer holding method Drop-in + end fac econtact retention

(clamp wafer by stroke end)
Wafer hold check Limited reflective fiber sensor(2 locations)
Network Protocol RS232C
Power source 24V DC±10%, 5A, 1-line

Customization:

Elevator mechanism Z:Yes
N:None
Chuck material P:PPS
K:PEEK
Z:Custom
Work size H:300mm
J: 200mm
K:150mm
Sensor type & chuck method V:CCD receptor(Drop-in+end facecontact retention) [Glass and compound wafer]
]]> Bernoulli Wafer Aligner For Thin Wafer Handling MAF-T Series https://www.xwetool.com/product/bernoulli-wafer-aligner-maf-t/ Thu, 16 Oct 2025 07:14:49 +0000 https://www.xwetool.com/?post_type=product&p=3283 Bernoulli Wafer Aligner For Thin Wafer Handling MAF-T Series

 

Data Sheet

Product Bernoulli Pre-Aligner For thin wafer handling needs
Model MAF-T
Handling object 100-150mm(thickness:50-800 um) wafer

150-200mm(thickness:50-800um)wafer

200-300mm(thickness:50-800um)wafer

(Please inquire with regard to special wafer.)
Alignment time 5.5 seconds or less(when not separate chucking)
Alignment accuracy XY=±0.1mm

T=±0.1deg
Wafer off-center limit ±5mm or less(wafer offset from chuck center)
Wafer holding method Wafer backside minimum partial contact
Wafer hold check Reflective red LED sensor
Network Protocol RS232C
Power source 24V DC±10%, 5A, 1-line

Customization:

Elevator mechanism Z:Yes
N:None
Chuck material B:Fluorocarbon polymers
Work size H:300mm
I:150~200mm
L:100-150mm(3-inch option supported)
Sensor type & chuck method T:CCD receptor(Contact type Bernoulli)
]]> Wafer Pre-aligner 300MM Edge-hold MAF-S Series https://www.xwetool.com/product/wafer-pre-aligner-300mm-maf-s/ Tue, 14 Oct 2025 02:14:43 +0000 https://www.xwetool.com/?post_type=product&p=3279 Edge-hold Wafer Pre-aligner 300MM MAF-S

This 300mm mechanically clamping wafer aligner minimizes wafer particle contamination by avoiding contact with the backside of the wafer.

Data Sheet:

Product Pre-Aligner Edge hold
Model MAF-S
Handling object 300mm wafer (notch/flat)

SEMl/JElDA standard wafer.

(Please inquire with regard tospecial wafer.)
Alignment time 8.5 seconds or less (20 seconds or less when separate chucking required)
Alignment accuracy T=±0.2deg
Wafer off-center limit ±1mm or less(wafer offset from chuck center)
Wafer holding method Wafer-edge partial gripping
Wafer hold check Photomicro sensor
Network Protocol RS232C
Power source 24V DC±10%, 5A, 1-line

Customizaation:

Elevator mechanism Z:Yes
N:None
Chuck material P:PPS
K:PEEK
Z:Custom
Work size H:300mm
J: 200mm
K:150mm
Sensor type & chuck method S:CCD receptor(grip type) [Glass and compound wafer]

 

]]> High Vacuum Wafer Robot MTP Series For 100-300mm Wafer https://www.xwetool.com/product/high-vacuum-wafer-robot/ Fri, 26 Sep 2025 03:34:37 +0000 https://www.xwetool.com/?post_type=product&p=3276 High Vacuum Wafer Robot MTP Series For 100-300mm Wafer

 

Data Sheet

Model Series MTP Series
Robot arm type Double arm
For wafer size 100mm – 300mm
Range of motion R1,R2:Arm length 220mm/430mm

(maximum arm reach,excluding end-effector)

T:360deg (±180deg from Home Pos.)

Z: Upper mounting 66mm(+64mm/-2mm from Home Pos.)

Lower mounting 104mm (+104mm/-2mm from Home Pos.)
Smallest swing diameter radius 580mm for arm length 220mm(When hand length to wafer center is 370mm)
Repeatability R1/R2:±0.1mm or less

T:±0.05°or less

Z:±0.05mm or less
Wafer handling method Recess(Pocket)

Contact us
Network protocol RS232C

command control
Utility Power/Power source Single-phase AC100V~115V ±10%, 7.5A, 1 line (for 100V ACspec)

Single-phaseAC200V~230V±10%,5A, 1 line (for 200V AC spec)

 

Customization:

 

Voltage 1:100V 2:200V
The number of arm driving axis 2:2 axes(Single arm, R, T)

3:3 axes(Branch arm, R1, R2,T)

4:3 axes(Single arm, X, Y and R,T)

5:3 axes(Single arm, R, T and P)
Elevator Stroke(Z) A:24mm
C:104mm
E:160mm
Robot arm length & Link(L) B:170mm 2 link

C:220mm 2 link

D:300mm 2 link
]]> Wafer Robot for Low Vacuum MPL Series 100-300 mm https://www.xwetool.com/product/wafer-robot-for-low-vacuum/ Fri, 26 Sep 2025 02:21:36 +0000 https://www.xwetool.com/?post_type=product&p=3275 Wafer Robot for Low Vacuum MPL Series 100-300 mm

 

Data Sheet

Model Series MPL Series
Robot arm type Single arm
For wafer size 100mm – 300mm
Range of motion R1/R2:Arm length 220mm /430mm(maximum arm reach,excluding end-effector)

T:360deg(±180deg from Home Pos.)

Z: Upper mounting 66mm(+64mm/-2mm from Home Pos.)

Lower mounting 104mm

(+104mm/-2mm from Home Pos.)
Smallest swing diameter radius 580mm for arm length 220mm(When hand length towafer center is 370mm)
Repeatability R1, R2:±0.1mm or less

T:+0.05°or less

Z:+0.05mm or less
Wafer handling method Recess(Pocket)

Contact us
Network protocol RS232C

command control
Utility Power/Power source Single-phase AC100V~115V ±10%, 7.5A, 1 line (for 100V ACspec) Single-phase AC200V~230V+10%,5A, 1 line (for 200V AC spec)

 

Customization:

Voltage 1:100V 2:200V
The number of arm driving axis 2:2 axes(Single arm, R, T)

3:3 axes(Branch arm, R1, R2,T)

4:3 axes(Single arm, X, Y and R,T)

5:3 axes(Single arm, R, T and P)
Elevator Stroke(Z) A:200mm
C:300mm
E:380mm
Robot arm length & Link(L) A:130mm 2 link

B:170mm 2 link

C:220mm 2 link

D:300mm 2 link
]]> TAZMO Semiconductor Wafer Handling Robots MTE Series https://www.xwetool.com/product/semiconductor-wafer-handling-robots/ Fri, 26 Sep 2025 02:19:22 +0000 https://www.xwetool.com/?post_type=product&p=3274 TAZMO Semiconductor Wafer Handling Robots MTE Series

Data Sheet

Model Series MTE Series
Motor type Servo motor
Robot arm type Single arm
For wafer size 100mm – 450mm
Operating axis R/T/W/Z/P
Range of motion R=590mm(maximum arm reach,excluding end-effector)

T=350deg(±175deg from Home Pos.)

W=360deg(±180deg from Home Pos.)

Z=300mm

P=180deg

(Remark: All values are based on MTQ-EC *-EV.)
Repeatability XY: ±0.1 mm

Z: ±0.05 mm

P: ±0.02 deg
Wafer handling method Vacuum chuck

Gripper

Recess(pocket)

Bernoulli
Wafer hold check Vacuum chuck: Vacuum sensor with digital display

Gripper:Photomicro sensor

Bernoulli:Reflective sensor
Network protocol RS232C
   
Utility Power/Power source Single-phase AC100V~115V ±10%, 7A, 1 line(for 100V ACspec)

Single-phaseAC 200V~230V+10%,5A，1line(for 200V AC spec)

 

Customizations:

 

Robot arm length & Link(L) B 190mm 2 link
D 245mm 3 link
C 220mm 2 link
E 300mm 3 link
G 300mm 2 link
Elevator Stroke(Z) A 200mm
C 300mm
D 350mm
Voltage 1 100V
2 200V
Hand E Changer[Double]
T Reverse
H Horizontal changer
S Single
End Effector G Gripper
R Recess hand
B Bernoulli
Z Custom
N None
V Vacuum chuck
]]> 300mm Wafer Handling Robot For Atmospheric TT301A-WA Series https://www.xwetool.com/product/300mm-wafer-handling-robot-tt301a-wa/ Mon, 16 Jun 2025 09:26:26 +0000 https://www.xwetool.com/?post_type=product&p=2509 300mm Wafer Handling Robot For Atmospheric TT301A-WA Series

 

Data Sheet

Model Series TT301A-WA
Motor type Servo motor
Robot arm type Double arm for cylindrical coordinate robot 178mm
For wafer size 100mm – 300mm
Operating axis R1/R2/T/Z
Range of motion R: Arm length 178mm

T: +185deg

Z: 330mm
Repeatability R: ±0.1 mm

T: ±0.02deg

Z: ±0.05 mm
Wafer handling method Vacuum chuck

Gripper

Recess(pocket)

Bernoulli

Mix(double hand)
Wafer hold check Vacuum chuck: Vacuum sensor with digital display

Gripper:Photomicro sensor

Bernoulli:Reflective sensor
Network protocol RS232C ETHERNET
Utility Power/Power source Single-phase AC200V~230V+10%  8A  1 line
]]> TAZMO Wafer Transfer Robot For EFEM, Atmospheric TT301A-RA https://www.xwetool.com/product/wafer-transfer-robot-tt301a-ra/ Mon, 16 Jun 2025 09:26:25 +0000 https://www.xwetool.com/?post_type=product&p=2508 TAZMO Wafer Transfer Robot For EFEM, Atmospheric TT301A-RA

Model Series TT301A-RA
Motor type Servo motor
Robot arm type Single arm,  for rectangular coordinate robot 220mm
For wafer size 100mm – 300mm
Operating axis R/W/T/Z
Range of motion R: Arm length 220mm

T: +185deg

Z: 330mm
Repeatability XY: ±0.1 mm

Z: ±0.05 mm
Wafer handling method Vacuum chuck

Gripper

Recess(pocket)

Bernoulli
Wafer hold check Vacuum chuck: Vacuum sensor with digital display

Gripper:Photomicro sensor

Bernoulli:Reflective sensor
Network protocol RS232C ETHERNET
Utility Power/Power source Single-phase AC200V~230V+10%  8A  1 line

 

Customization:

 

Wafer Handling Method 1) V: Vacuum chuck
2) G: Gripper
3) R: Recess (pocket)
4) B: Bernoulli
5) M: Mix (For double-hand)
Hand Type 1) N: None
2) V: Double reverse (without harmonic gear) standard
3) U: Reverse (with harmonic gear) high load
4) W: Double reverse (with harmonic gear) high load
Mapping Sensor 1) N: No mapping sensor
2) T: Through-beam sensor
3) R: Reflection-type sensor
Slide Rail 1) N: None
2) S: Standard (80w motor)
3) H: High speed (200w motor)
Slide Rails Stroke N: None
A: 505mm
B: 1010mm
C: 1515mm
D: 2020mm
E: 2525mm
F: 600mm
G: 1200mm
H: 1800mm
J: 00mm
K: 800mm
Position of Motor Installation N: No slide rail
R: Install on the right (Standard)
L: Install on the left
]]> Industrial Robotic Arm For PLP https://www.xwetool.com/product/industrial-robotic-arm-plp/ Mon, 16 Jun 2025 09:26:24 +0000 https://www.xwetool.com/?post_type=product&p=2507 TAZMO Robot PLP Double Arm, Customizable https://www.xwetool.com/product/tazmo-robot-plp-double-arm/ Mon, 16 Jun 2025 09:26:24 +0000 https://www.xwetool.com/?post_type=product&p=2506 TAZMO Robot PLP Double Arm, Customizable

Data Sheet

Model Series PLP Series
Motor type Servo motor
Robot arm type Double arm
Target work/Handling object Square substrate 300-650mmm
Operating axis R1/R2/T/Z
Range of motion RI-axis, R2-axis: Maximum arm reach 760mm(from swivel center)

T:±185deg

Z:500mm

S:880mm
Repeatability R2,R2 ±0.1 mm

T: ±0.03 deg

Z: ±0.1 mm

S: ±0.25 mm
Wafer handling method Vacuum chuck

Gripper

Recess(pocket)
Wafer hold check Vacuum chuck: Vacuum sensor with digital display

Gripper:Photomicro sensor
Network protocol RS232C ETHERNET
Utility Power/Power source Single-phase or Three-phase AC200V~230V +10% 5A~30A

Customization:

Type Description
Arm type T: Cylindrical Coordinate Standard Single
W: Cylindrical Coordinate Standard Double
R: Square Coordinate Standard Single
Elevator type S: Standard
W: Telescopic 2-step Elevation
Hand type N: None
H: Horizontal changer
T: Reverse
Arm 1: 385mm(R·W)
2: 179mm(R·W)
4: 220mm(R·T)
6: 300mm(T)
8: 370mm
Elevator 1: 500mm(S·W)
2: 700mm(W)
4: 300mm(S)
Slide rail 0: None
1: 505mm
2: 1010mm
3: 1515mm
4: 2020mm
6: 600mm
8: 1800mm
9: 880mm
I: 2000mm
J: 2060mm
Work gripping method (hand 1) N: None
G: Gripper
V: Vacuum chuck
R: Recess (without seating sensor)
P: Recess (with seating sensor)
Work gripping method (hand 2) N: None
V: Vacuum chuck
G: Gripper
R: Recess (without seating sensor)
P: Recess (with seating sensor)
Mapping sensor T: Transparent type
N: None
R: Reflective type
]]>