High Vacuum Wafer Robot MTP Series For 100-300mm Wafer
Data Sheet
| Model Series | MTP Series |
| Robot arm type | Double arm |
| For wafer size | 100mm – 300mm |
| Range of motion | R1,R2:Arm length 220mm/430mm
(maximum arm reach,excluding end-effector) T:360deg (±180deg from Home Pos.) Z: Upper mounting 66mm(+64mm/-2mm from Home Pos.) Lower mounting 104mm (+104mm/-2mm from Home Pos.) |
| Smallest swing diameter radius | 580mm for arm length 220mm(When hand length to wafer center is 370mm) |
| Repeatability | R1/R2:±0.1mm or less
T:±0.05°or less Z:±0.05mm or less |
| Wafer handling method | Recess(Pocket)
Contact us |
| Network protocol | RS232C
command control |
| Utility Power/Power source | Single-phase AC100V~115V ±10%, 7.5A, 1 line (for 100V ACspec)
Single-phaseAC200V~230V±10%,5A, 1 line (for 200V AC spec) |
Customization:
| Voltage | 1:100V 2:200V |
| The number of arm driving axis | 2:2 axes(Single arm, R, T)
3:3 axes(Branch arm, R1, R2,T) 4:3 axes(Single arm, X, Y and R,T) 5:3 axes(Single arm, R, T and P) |
| Elevator Stroke(Z) | A:24mm C:104mm E:160mm |
| Robot arm length & Link(L) | B:170mm 2 link
C:220mm 2 link D:300mm 2 link |
