Wafer Pre-Aligner MAF-R – Edge Contact Free
| Product | Pre-Aligner Back-side VAC Chucking MAF-R |
| Handling object | 200mm-300mm
SEMI&JEIDA standard wafer (Please inquire with regard tospecial wafers such as glass wafer.) |
| Alignment time | 4.5 seconds or less(when processing 300mm) |
| Alignment accuracy | XY=±0.1mm or less
T=±0.1deg or less |
| Wafer off-center limit | ±5mm or less (wafer offset from chuck center) |
| Wafer holding method | Backside vacuum chuck |
| Wafer hold check | Vacuum sensor with digital display |
| Network Protocol | RS232C
RS485(optional) Parallel trafic (optional) |
| Power source | 24V DC±10%, 5A, 1-line |
Customization:
| Elevator mechanism | Z:Yes |
| N:none | |
| Chuck material | P:PPS |
| K:PEEK | |
| Z:Custom | |
| Work size | A:200-300mm |
| B:100-200mm(3-inch option supported) | |
| C:150-300mm(Compatible with 3 sizes) | |
| Sensor type & chuck method | R:CCD receptor(vacuum type) [Glass and compound wafer] |
