TAZMO Wafer Aligner 300MM For Compound and Glass Wafer
Data Sheet
| Product | Pre-Aligner Edge hold |
| Model | MAF-V |
| Handling object | 300mm SEMl standard wafer
(Please inguire with regard tospecial wafer) |
| Alignment time | 10.5 seconds or less(21 seconds or less when separate chucking required) |
| Alignment accuracy | T=±0.3deg |
| Wafer off-center limit | ±1mm or less(wafer offset from chuck center) |
| Wafer holding method | Drop-in + end fac econtact retention
(clamp wafer by stroke end) |
| Wafer hold check | Limited reflective fiber sensor(2 locations) |
| Network Protocol | RS232C |
| Power source | 24V DC±10%, 5A, 1-line |
Customization:
| Elevator mechanism | Z:Yes |
| N:None | |
| Chuck material | P:PPS |
| K:PEEK | |
| Z:Custom | |
| Work size | H:300mm |
| J: 200mm | |
| K:150mm | |
| Sensor type & chuck method | V:CCD receptor(Drop-in+end facecontact retention) [Glass and compound wafer] |
