Wafer Pre Aligner MAF-A – Back-side VAC Chucking
Product：Pre-Aligner Back-side VAC Chucking
Handling object：200mm-300mm wafer；SEMl/JElDA standard wafer.
Alignment time：3 seconds or less(when processing 300mm)
Alignment accuracy：XY=±0.1mm or less，T=±0.1 deg or less
Wafer off-center limit：±5mm or less(wafer offset from chuck center)
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Wafer Pre Aligner MAF-A – Back-side VAC Chucking
Product：Pre-Aligner Back-side VAC Chucking
Handling object：200mm-300mm wafer；SEMl/JElDA standard wafer.
Alignment time：3 seconds or less(when processing 300mm)
Alignment accuracy：XY=±0.1mm or less，T=±0.1 deg or less
Wafer off-center limit：±5mm or less(wafer offset from chuck center)
