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Double Arm Wafer Handling Robot, High Speed Transfer
- Model No: NEW
Motor type: servo motor - Robot arm type：double arm
- Operating axis: R1/R2/T/Z
- Operating environment: Atmospheric
- suitable for silicon wafer 100-300mm
- Brand: TAZMO
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Double Arm Wafer Handling Robot, High Speed Transfer
This semiconductor wafer handling robots features in high speed and ultra clean, making it an ideal option for advanced process.
Data Sheet
Model Series | NEW Series |
Motor type | Servo motor |
Robot arm type | Double arm |
For wafer size | 100mm – 300mm |
Operating axis | R1/R2/T/Z |
Range of motion | R1,R2=arm length:179mm,350mm maximum arm reach (excluding end effector) T=340deg Z=300mm |
Repeatability | R1,R2=±0.1mm T=+0.05deg Z=±0.05mm
|
Wafer handling method | Vacuum chuck Gripper Recess(pocket) Bernoulli |
Wafer hold check | Vacuum chuck: Vacuum sensor with digital display Gripper:Photomicro sensor Bernoulli:Reflective sensor |
Network protocol | RS232C |
Utility Power/Power source | Single-phase AC100V~115V ±10%, 7A, 1 line(for 100V AC spec) Single-phaseAC 200V~230V+10%,5A，1line(for 200V AC spec) |
Customization
TAZMO semiconductor wafer handling robots can be customized according to client’s configuration request. Please provide such information below when you send us inquires:
Options: | 1. Through-beam mapping sensor. |
2. Gripper | |
3. Reverse mechanism(P axis) (Only applicable for top hand with stepping motor | |
4. Slide rail(X axis), Controller change (only for 200V specifications) | |
Robot arm length(L): | 1: 179mm |
2: 150mm | |
Elevator Stroke(Z) | 1: 300mm |
2: 350mm | |
Votage | 1:200V |
2:100V |